In electronics manufacturing, particularly high standards are placed on manufacturing precision—especially regarding the flatness of substrates such as printed circuit boards (PCBs) and flexible printed circuits (FPCs). Even the smallest deviations can significantly disrupt the manufacturing process.

High-resolution surfaceCONTROL 3D sensors are used for reliable flatness inspection. These sensors detect even the finest height differences with the highest precision, enabling a full-surface analysis of substrate flatness—inline and in real time. At the same time, they can be seamlessly integrated into existing manufacturing and automation lines, ensuring a consistent, quality-assured process.

The surfaceCONTROL 3D sensors capture entire surfaces in a single scan. A high-resolution point cloud is generated from the 3D snapshots, forming a digital elevation model of the surface. The repeatability of up to 0.25 µm achieved in this process allows for the detection of even the finest planarity deviations. Different measurement fields also enable adaptation to substrates of a wide variety of formats and geometries.

For integration into automated production lines, the sensors offer a powerful interface architecture. In addition to Gigabit Ethernet for fast data transmission, they feature digital I/O ports and, optionally, a gateway that enables connection to industrial fieldbuses such as PROFINET, EtherCAT, and EtherNet/IP. The high measurement speed enables their use in stop-and-go processes on conveyor belts or rotary indexing tables.