Sputtering systems Manufacturers online

Sputtering systems are used to coat surfaces with thin layers.

They utilize a physical process that is often used in the semiconductor industry, optics, materials research and surface finishing.

Below you will find the functional principle of sputtering systems, an overview of the processes used, important process parameters, the main areas of application and the advantages and disadvantages. There is also an overview of the safety and optimization aspects of sputtering systems:

Operating principle:

Sputtering is a physical deposition process (PVD - Physical Vapor Deposition) in which atoms are removed from a target (coating material) by bombardment with high-energy ions and deposited on a substrate.
Usually a noble gas (e.g. argon) is ionized in a vacuum chamber and the resulting ions are accelerated onto the target to remove material.

Applied sputtering processes:

1. DC sputtering (direct current):
Suitable for conductive materials such as metals.

2. RF sputtering (Radio Frequency):
Used for non-conductive or dielectric materials as it utilizes high frequency electric fields.

3. Magnetron sputtering:
Uses magnetic fields to increase the density of ions and therefore the removal rate. This improves efficiency and is widely used in industrial applications.

4. Reactive sputtering:
This is where a reactive gas (e.g. oxygen or nitrogen) is introduced into the process to deposit compounds such as oxides or nitrides.

Important process parameters:

• Gas pressure and composition: Determines the quality and type of layer produced. Argon is usually used, but reactive gases such as oxygen or nitrogen are also used.
• Power and voltage: Higher power increases the removal rate from the target, but can also affect the coating quality.
• Target-substrate distance: Influence on the homogeneity of the coating. Too large a distance can lead to an uneven coating.
• Substrate temperature: In some processes, the substrate is heated to improve coating adhesion and control the crystal structure.

Typical applications:

1. Semiconductor manufacturing:
Production of layers in microelectronics and integrated circuits (e.g. metallizations on silicon chips).

2. Optical coatings:
Thin films on optical elements such as spectacle lenses, mirrors and camera lenses.

3. Data storage:
Coating of storage media such as hard disks.

4. Tool coating:
Hard protective coatings for tools and machine parts to reduce wear and corrosion.

5. Decorative coatings:
Finishing of surfaces (e.g. on watches, jewelry or consumer goods).

Advantages of sputtering systems:

• High coating quality: Produces dense, homogeneous and pure coatings.
• Wide range of materials: A wide range of materials (metals, semiconductors, insulators, compounds) can be used.
• Good layer thickness control: Precise control of the layer thickness, often in the range of a few nanometers.
• More environmentally friendly than chemical processes: No hazardous chemicals are required and the process takes place in a vacuum.

Disadvantages:

• Slow coating rate: compared to chemical processes (CVD), sputtering is often slower.
• High costs: The vacuum technology and the often complex equipment can result in high acquisition and operating costs.
• Loss of material at the target: Some of the deposited material is not used and remains on the chamber wall.

Safety aspects when operating sputtering systems:

• Vacuum technology: Requires special safety precautions when dealing with high vacuum.
• High-voltage devices: Sputtering systems work with high voltages, which makes appropriate safety measures necessary.
• Inert gases: Gases such as argon must be handled under safe conditions to avoid leaks and uncontrolled gas discharges.

Process optimization:

• Film thickness and uniformity can be improved by optimizing process parameters and substrate handling.
• Cleaning the target and substrate before the process is important to avoid contamination and defects in the coating.

Sputtering systems are an indispensable tool in modern production technology, especially in microelectronics and optics. Their ability to produce precise and pure layers makes them a key technology in many high-tech industries.

Here are the most important aspects to look out for when buying sputtering systems:

When buying a sputtering system, there are a number of important criteria that should be considered depending on the application and requirements.

• Make sure that the system is suitable for the materials to be processed (metals, semiconductors, oxides, nitrides). Some sputtering systems are more specialized than others.
• The size and shape of the substrate to be coated (e.g. wafer, glass, plastic) will determine the size of the chamber and the substrate handling systems.
• Determine which sputtering process is suitable for your application:
• DC sputtering: For conductive materials (metals).
• RF sputtering: For non-conductive or dielectric materials.
• Magnetron sputtering Higher efficiency and removal rate, suitable for many industrial applications.
• Reactive sputtering: Important if you want to deposit compounds such as oxides or nitrides.
• Make sure that the system has precise control options for the layer thickness, e.g. through layer thickness monitoring (quartz microbalances).
• Make sure that the system can apply uniform layers over large areas if this is required.
• Select a chamber that offers sufficient space for the desired substrate. Larger chambers may be required for industrial applications.
• Good vacuum quality is critical for film purity and process stability. check the type of vacuum pump (turbomolecular pumps or cryopumps) and the achievable base vacuum level.
• Some systems offer multiple target positions for different materials. This is useful if you want to deposit different materials without interruption (co-sputtering).
• Changing targets easily and quickly can be important, especially for changing applications.
• Look for systems that keep the substrate stable and secure during the process.
• Rotating substrate holders increase the homogeneity of the layer and improve the layer quality.
• If precise control of the substrate temperature is required, the system should provide heating or cooling.
• Modern equipment should have intuitive control software that allows easy adjustment and monitoring of process parameters.
• Especially for serial production, it is helpful if the system offers automated processes, e.g. for target change, substrate handling or vacuum generation.
• Pay attention to how easily spare parts and consumables such as targets or pump oil are available.
• A system should be easy to maintain to minimize downtime. Some systems have self-cleaning chambers or filters that reduce maintenance.
• Energy consumption should be considered for continuous operation or industrial production.
• The system must be safe to handle high vacuum, especially with large chambers.
• As sputtering systems work with high voltages, safety precautions against electrical hazards should be in place.
• If reactive gases are used (e.g. oxygen, nitrogen), the system must be equipped with safe gas systems.
• Check that the system meets relevant certifications such as CE, ISO or other industry or region-specific standards, especially in safety-critical areas or for special applications.
• Consider the basic costs, but also the costs for extensions, upgrades and spare parts.
• Consider the cost of energy consumption, vacuum pumps, target materials and general operation of the system.

When purchasing a sputtering system, in addition to the technical specifications, you should also consider the long-term operating costs, maintenance requirements and flexibility for different applications. Careful consideration of the above factors will help you select the right equipment for your specific needs.

Sputtering systems can be purchased from a variety of suppliers. Comprehensive information about manufacturers and suppliers of Sputtering systems from all over the world can be found on Exportpages.