MICRO-EPSILON Messtechnik GmbH & Co. KG

Manufacturer
Germany
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Manufacturer
Germany
Send request

23.05.2026 01:05

90° sensor for stable inline wafer measurement

With the IMP-NIR-TH3/90/IP68 sensor, Micro-Epsilon is expanding its interferoMETER portfolio with a particularly robust sensor for inline thickness measurement of silicon and SiC wafers. The sensor has a 90° beam path and a small working distance of just 3 mm, making it ideal for applications with very limited installation space.

Stable measurement in the grinding process

The sensor really comes into its own in demanding processes such as slurry grinding: The robust IP68 stainless steel housing allows it to be used directly in the machine, even in high humidity and particle contamination. Clean optics are particularly important in grinding and lapping processes. This is ensured by the integrated air purge device, which keeps the optics permanently free of particles and thus enables stable measurements.

90° beam guidance for confined installation situations

A key feature of the sensor is the 90° beam path, which enables integration even where installation space is very limited. The working distance of just 3 mm and the very small light spot with a diameter of 15 µm create the basis for precise inline measurements directly in the machine. The IMP-NIR-TH3/90/IP68 sensor is operated with the IMS5420 controller and provides a compact, process-reliable solution for measuring highly doped wafers, where high signal quality is crucial.