Miniaturized and highly complex: the challenges of electronics

From e-mobility to the smart home, from mobile communications to Industry 4.0 – as the application possibilities for electronics continue to develop, reliable quality assurance of electronic components – particularly semiconductor devices and their connections – becomes ever more important. One major challenge is miniaturization: The smaller and more complex components become, the greater the need for high-resolution and high-magnification inspection systems that can detect the smallest defects even in hidden solder joints.

Quality assurance and failure analysis with Comet Yxlon

Based on extensive market research and input from electronics manufacturers, Comet Yxlon designed their X-ray and CT inspection systems to facilitate dependable quality assurance and failure analysis. At the same time inspection results can be used to optimize and adjust production processes – to further avoid rejects and complaints and to increase cost efficiency.

Inspection of surface-mounted technology

High-resolution Comet Yxlon X-ray inspection is widely used in failure analysis and product quality testing of electronic components. In the inspection of surface-mounted technology (SMT), X-ray images help identify material defects and quality characteristics of solder joints in PCB components like BGA and BTC packages as well as though hole technology (THT) connections and ensure their electrical and thermal conductivity.

Further applications of industrial X-ray in electronics

• Integrated power electronic components like IGBT
• Discrete components such as transistors
• Connectors
• Camera lenses for e. g. cell phones or automotive
• Coils
• Batteries
• Assembly checks of complete devices, e.g., cell phones for final acceptance or failure analysis of returns