New 3D X-ray system from Comet Yxlon

At this year's Productronica we will come up with a novelty and present our new 3D X-ray system, which we have developed especially for the demanding semiconductor market, on Tuesday, November 14 at 3 pm at our booth B2.454.

We are convinced that our advanced 3D X-ray technology is the future of advanced packaging.

Can 3D X-ray be used as a faster and more cost-effective alternative to FIB-SEM? YES
Can 3D X-ray shorten the ramp-up process and bring new products to market faster? YES
Can 3D X-ray dramatically reduce scrap and increase yield? YES
Is 3D X-ray the best tool to reach the zero defect goal faster? YES

We would love to have you join us for the launch of our new inspection system for the Semiconductor industry. Experience live how fast and brilliant solder bumps can be displayed three-dimensionally with a voxel size of less than 1 µm.

We look forward to your interest and your questions to our experts.

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