Comet Yxlon GmbH

CA20

Product series: CA
Industry: Advanced Packaging, Semiconductor, Electronics, Science & Research
Defect size: <1 µm, <50 µm, <1 mm
Component size: <435 mm
Operating mode: 3D X-ray, 2D/3D

CA20 Highlights

• Developed for the semiconductor industry
• Non-destructive technology for three-dimensional insights into solder joints within minutes
• Repeatable results through reliable and precise technology that supports a stable inspection routine
• Efficient software-assisted inspection, including automatic void analysis with Void Insights
• Dose Manager for the protection of radiation-sensitive components

CA20 - The fastest path from R&D to ROI

The semiconductor industry is a high-speed industry. Every day counts in the race for innovation. As an inspection system specifically designed to meet the challenges of complex 3D ICs in advanced packaging, the CA20 helps you keep up the pace - and stay ahead of the competition. The CA20 enables the rapid inspection of prototypes for new packaging process nodes: The faster you find and fix the root cause of start-up problems, the faster you achieve the desired yield - and return on investment (ROI).

• Chip-on-substrates including fan-out package solder joints (C4 bumps and copper pillars)
• 2.5 and 3D IC package solder joints including microbumps
• Substrate strip solder bumps
• Sensors
• MEMS and MOEMS