- Precise performance (tight tolerance and stability available)
- Excellent heat resistance and environmental characteristics.
- High mechanical shock resistance
- Suitable for reflow soldering
- Automatic mount by tape and reel
- Compactness and extremely thin (height: 0.90 mm max.)
Compact design 3.2 x 1.5 x 0.7 mm weight 12.4 mg. Ceramic package and metal lid assures extreme accuracy and high reliability by electron beam sealing. Lead-free soldering is available.
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