Speed, resolution, 2D or 3D - depending on the application, manufacturers have different priorities when inspecting semiconductor products. Comet Yxlon offers a variety of X-ray and CT inspection systems tailored to specific inspection tasks.
2D radioscopy
- Fast image generation, ideal for in-process inspections
- Main application: traditional packaging
- Inspection of simple wire bonds, vias and solder bumps
- Available with Cheetah and Cougar - the best image in the shortest time with sub-micrometer resolution
Computer Laminography (CL)
- Determination of the spatial properties of components as well as the position and size of defects
- Main application: Advanced packaging
- Sampling inspection of multilayer packages and integrated devices
- Available for Cheetah and Cougar with vertical beam path and highest resolution as well as for the FF20 CT and FF35 CT systems with horizontal beam path
3D computed tomography (CT)
- 3D measurements to determine spatial properties, defect position and dimensions
- Main application: detailed defect analysis
- Available with the FF20 CT and FF35 CT systems with intuitive operation thanks to the Geminy user interface and as an add-on with Cheetah and Cougar
- CT metrology