Qingdao JZLEAP Semiconductor Co.,Ltd.
14.08.2024 10:20
Substrate is the underlying material of all semiconductor chips, playing the role of physical support, thermal conductivity, and electrical conductivity. According to the latest survey by TrendForce Tiburon Consulting, due to the rising popularity of electric vehicles and the trend of 800V high-voltage electric vehicle architectures, it is expected that the global automotive market demand for 6-inch conductive SiC substrates in 2025 will reach 1.69 million pieces. The upstream supply of SiC substrate materials will be the main bottleneck in the production of SiC power devices due to the complex manufacturing process, high technology entry barrier and slow growth of SiC substrates. Most of the n-type SiC substrates for power semiconductor devices are 6 inches in diameter.
Category
Offers
Country
China
Region
SHANDONG
Locality
QINGDAO