Shenzhen PEAK Technology Co., Ltd

Manufacturer
China
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Arms QMS|Single Layer UL|Multilayer UL ISO 13485|ISO 9001|ISO 14001 IATF 16949|CQC|OHSAS 18001 ENIG ROHS|HASL ROHS|OSP ROHS ENIG REACH|HASL REACH|OSP REACH

Manufacturer
China
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Arms QMS|Single Layer UL|Multilayer UL ISO 13485|ISO 9001|ISO 14001 IATF 16949|CQC|OHSAS 18001 ENIG ROHS|HASL ROHS|OSP ROHS ENIG REACH|HASL REACH|OSP REACH

23.08.2023 10:40

Electrical Fr4 PCB Board

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PCB in Multilayer Board Prototype 94V0 PCBA

Regular PCB
Up to 64 Layers
FR4 TG135/TG150/TG170
Halogen Free/CTI≥600
Aspect Ratio (Finish Hole) 28:1
Sample Expedited 8 Hours(1-2Layer)

HDI PCB
Blind/Buried Via
5+N(N+M)+5 Structure
Trace Width/Spacing 1.6/1.6mil
Laser Hole Size(mm)≥0.075
High Density Interconnector

High Frequency PCB
More than 85+ Types
Rogers/Arlon/Taconic/Isola/
Nelco/F4B Serices,etc
Materials can be Specified
Impedance Tolerance ±5%(min)

High Speed PCB
Panasonic Megtron4/6/7
TU-872SLK/Isola-FR408HR,etc
Impedance Tolerance ±5%(min)
Dimension Accuracy ±0.02mm(min)
Line Width/Space Accuracy ±5%

Metal Core PCB
Thermal Conductivity 1-398W/m.K
Aluminum/Copper AC 500-4000V
Post-bonding/Pre-bonding
Sweat-Soldering/Conductive Adhesive
Press-Fit/Embedded Coin(I, T U)

Rigid-Flex PCB
2-24 Layers
Book/Air-gap/Fly-tail
Unsymmetrical/Semi-Flex
Width of Flexible Zone 3mm(min)
Dimension Accuracy ±0.05mm(min)

IC Substrate&Substrate-Like PCB
CSP/FC-CSP/SIP/FC-BGA/WB-CSP
FR4/BT/High-Speed Material
Trace Width/Space 12/12μm
SM Registration:±20μm
Strict SM Flatness Control ≤5μm

Specialty PCB
Ceramic/Glass Material
Hybrid Material Lamination
Buried Capacitance/Resistance
PTH/NPTH Step Slots
Uneven/Segmented/Step Gold Finger

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Category
Offers

Country
China

Region
Shenzhen

Locality
5th floor, building D, Zhongxi Industrial Park, Gonghe village, Shajing Town, Bao'an District, Shenzhen