Comet Yxlon GmbH

• Product range: CC Series
• Industry: Automotive, electronics, aerospace, science and research, semiconductor
• Defect size: <1µm, <50µm, <1mm, >1mm
• Component size: small, medium
• Operating mode: 2D, 3D, 2D/3D

• Reliable, fast and repeatable inspections - manual and automatic
• Automatic void analysis with VoidInspect
• Easy-to-use, dynamic image enhancement filters, e.g. eHDR
• Best laminography results with micro3Dslice and FF CT software
• Dose reduction and low dose detector mode for sensitive components
• Optional high loading capacity (< 20 kg)

Due to the continuous miniaturization of electronic components, more and more components have to fit into an ever smaller area. For the most accurate and repeatable results, a test system should therefore not only deliver the highest performance and resolution, but also be equipped with dynamic image enhancement filters. The Cheetah EVO features:

Large flat panel detectors with up to 50% larger inspection area for a better overview and faster work processes due to fewer steps in automatic sequences

Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy defect analysis - forr significant cost savings compared to micro-slicing

Automatic void analysis with VoidInspect CL or DR, the laminography- or radioscopy-based inspection workflows that enable the fast, non-destructive evaluation of voids in the solder joints of PCB components.

THTInspect DR, the semi-automated defect analysis for fill level inspections of THT-based components in 2D

Integration into the production line: direct communication with inline AOI/AXI inspection systems through the use of ProLoop

Optional high loading capacity (< 20 kg) with reinforced mechanics and sample table: multiple components and electronic connections in fixed housings can be inspected simultaneously to save time.

Semiconductor testing: maximum resolution with minimum voltage

Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, their inspection requires maximum image resolution at low power and low voltage. Void assemblies, including multi-area voiding, require accurate, repeatable inspection routines. The Comet Yxlon

Cheetah EVO offers:

• A high sensitivity detector with optional low dose mode
• High detail detection through an integrated image chain
• Integrated automatic defect detection with FGUI (e.g. voids in bumps)